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Los Angeles, California – July, 2020 – Adexa, Inc., the leading provider of intelligent AI-powered S&OP and S&OE for supply chain optimization and digitalization, today announced successful deployment of Adexa’s latest version of its supply chain planning solutions at Teledyne Dalsa. Dalsa has been using Adexa planning applications for many years to overcome their business challenges such as on-hand inventory reduction, meeting customer requested date and capacity allocation for the demand load and engineering forecasts. “Adexa was able to help Dalsa to generate accurate plans with complete pegging of allocated supplies, configuring reusable materials, and planning of split lots for engineering; resulting in improved delivery performance and much better visibility,” Said John Hosford, VP of Solutions Delivery at Adexa; “Furthermore, Adexa attribute-based planning feature allows Dalsa to utilize generic product codes, thus avoiding proliferation of SKUs.” Given the complexity of high tech supply chain and the highly asset-intensive environment of fabrication lines. It is imperative that the system can digitally represent the operations and be able to optimize tens of millions of variables including WIP and on-hand inventory, mix of products, equipment utilization and demand pressures.
“One of the unique features of Adexa solutions is generating accurate plans. Accurate plans require accurate models and the capability to represent the physical world digitally,” continued, John Hosford. “Systems must be able to produce plans that are executable, therefore they’d require very little or no manual planning. We are delighted that our digital technology has enabled Dalsa to reach such a high level of supply chain maturity.”
Teledyne DALSA is an international leader in high performance digital imaging and semiconductors with approximately 1000 employees world-wide. Established in 1980 and acquired by Teledyne Technologies in 2011, Teledyne DALSA designs, develops, manufactures, and markets digital imaging products and solutions, in addition to providing semiconductor products and services. Their core competencies are in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.